The department for Payloads & Systems develops, designs, manufactures and validates complex state of the art payloads for telecom and broadband applications. Recently, so called RF / optical payloads using digital processing and TESAT‘s unique Laser Communication Terminal (LCT) extended our portfolio towards modern optical technologies. High power subsystems like multiport amplifiers and radar subsystems are rounding up the range of products. Our Earth observation portfolio encompasses also digital data downlink subsystems that facilitate the transmission of data acquired by LEO satellites to ground. High data rate gigabit modulators enable our customers to increase their operational flexibility with ultra high downlink speeds.
We follow a strict customer requirements driven approach of delivering tailored turn key systems on ground and, if required, in-orbit. All necessary disciplines like systems engineering, equipment as well as antenna procurement and test support at customer premises are covered by a very experienced workforce. Many systems already delivered are operated in orbit by our customers.
TESAT is a competent partner for the development of intelligent systems. Due to increasing complexity, greater product variances and shorter product life cycles, all necessary disciplines must already be incorporated in the early product development phases. In addition, customer expectations regarding attractive cost and high reliability have to be fulfilled. Our systems engineering has decades of experience as well as numerous inhouse specialist disciplines and covers all necessary fields of activity such as system architecture design with requirements management including all essential analyses, simulations, tests and validations.
Payload Engineering & Systems Development
Skilled & experienced workforce in systems engineering
Proven experience in development & design of complex telecom & Earth observation payloads & subsystems with expertise in
RF engineering & analyses
Digital signal processing & coding
Antenna technology & procurement
Mechanical & thermal design
Design, development & verification of
Telecom payloads & repeaters
Bent pipe, processed RF / hybrid payloads
Earth observation digital data downlink subsystems
High rate modulation (incl. antennas)
Multiport amplifiers, radar subsystems
Delivery of turn key solutions, incl. in-orbit delivery
Numerous systems already operating successfully in-orbit
MATLAB, Simulink, Mathcad
RF simulation in ADS, CST
In-house developed simulators
TICRA antenna design software
AGI Satellite Tool Kit (STK)
Siemens NX with extensions
V-model based development
Design to Cost
Design for Six Sigma
Requirements engineering with
IBM Rational DOORS
More than 20 engineers with over 200 years of experience in systems engineering from the following disciplines
Optical engineering & physics
Design, management and system thinking on a broad scope covering the following fields
Our highly motivated team develops optical and optoelectronic communication devices and systems – transferred from scratch into prototype hardware, VHDL code and software. By close alignment of requirements with our customers and feasibility checks in an early development stage, we get optimum results. Functional prototypes and breadboards can be manufactured and verified in short term.
In our labs, tests can comprise the complete optical transmission path including transmitter and receiver devices to confidentially verify overall functionality. Our direct and agile development approach results in fast development cycles and short time period from concept to hardware.
TESAT is enabling the optical communications market supporting the Laser Communication Terminals‘ (LCT) in-orbit maintenance and direct-to-Earth (DTE) missions. The LCT In-Orbit Services team has developed automated tools for converting and analysing the LCT´s telemetries (TMs) including the generation of performance and trend analyses. TESAT also provides engineering help desk (1st & 2nd level) and a complete end-to-end (E2E) test bed for validating new technologies, including optical groundstation (OGS) operators and mission planning.
Optical Communications & Optoelectronics
Great experience in design of ultra low noise current sources for lasers & pump modules
Development team experienced in mixed signal & optoelectronic circuit design
Design of high precision sensor electronics for laser frequency control
Design of high speed optical transmitters, receivers & tracking modules
Development of processor & FPGA based control units
Optimum design results with regard to harsh space environments
Development of multi PCB systems incorporating mixed signal, high speed digital & optoelectronic features
Rapid development of prototypes (concept to board)
TESAT Laser Communication Terminals performed more than 40,000 successful optical links due to August 2020. The LCTs have an average of about 1,000 links per month.
Today, optical communication is commercially and successfully applied for high capacity data transmission between satellites. In consequence, there is also high interest for optical data transmission from and towards ground. Applications range from feeder links (ground to GEO), over links from LEO direct-to-Earth (DTE) and links between ground and airborne platforms (High Altitude Platforms (HAPs), UAVs) up to quantum key distribution from space to ground.
Enabler of the optical communication market support
Providing customer support in the transient to optical communication
The MMIC and RF module development team develops and designs ICs and RF modules for various applications, e.g. SSPA (solid state power amplifier) and LCAMP (linearized channel amplifier). Designs are based on commercially available foundry processes (GaAs, GaN or Si). During design phase the IC integration into the package is taken into account such that the final RF module can be optimally manufactured on TESAT‘s highly automated production lines.
RF communication assemblies is responsible for the development and design of whole RF communication systems as well as its individual components. During design phase, complex system simulations using basic building blocks and endto- end RF parameter-simulations are performed in order to anticipate an optimum overall system performance, including all active and passive structures.
Starting point in development of power supply equipment is the mutual understanding of product requirements between the customer and TESAT. Based on decades of experience in power supply development, customized technical and programmatic solutions are elaborated. Along with an appropriate toolset for modelling and simulation, the electrical design will finally result in schematics ready for PCB layout.
IC design using GaAs, GaN or silicon based processes
RF module design for highly automated assembly as well as highly automated manufacturing
HTCC, LTCC & PCB-based module design
Complete design chain from circuit level design up to DRC / LVS rule checking
More than 12 years experience in MMIC & RF design in the satcom frequency bands ranging from L- to Q-Band
Single & multichannel
Up to Q-Band (42 GHz) frequencies
Keysight ADS & Momentum 3D EM Simulator
Dassault CST Studio
High voltage & power supply design
Experience with wide range of standard power topologies
High voltage design
Radiation hardened power converter design
New Space experience
Analog & digital circuits (e.g. for signal processing, control, protection & interfaces)
Power supply development & design ranging from several Volts / Watts up to many kV / kW-designs
Power supplies for all kinds of space equipment
Space based simulation of complex power supplies
High voltage FEM based simulation tools (Keysight ADS)
Mentor Xpedition Suite
Development with Design for Six Sigma methods
RF communication assembly design
System design & synthesis of complex RF assemblies incorporating:
RF design for space enviroment
Modelling of non-linear RF components & equipment
Microwave power modules based on travelling wave tube amplifiers as well as solid state power amplifiers
Up- / Downconverters
Multiplexers, filters & components
ECSS Multipactor tool
In-house modematching & synthesis tools
RF communication assembly analysis
RF simulation of planar & 3D structures
Magnetic field simulations (e.g. for isolators & mechanical systems)
Agile or classic in the traditional waterfall process? Our embedded software development team is as flexible as your requirements. Many years of experience in traditional software development and maintenance according to DLR / ECSS standards, combined with constant curiosity to approach new projects creatively and agile, guarantee high-quality software solutions for a wide variety of applications and customer requirements.
TESAT's digital development department provides everything needed to develop digital equipment or modules. Starting with digital signal processing algorithm development for efficient and safe data transmission, the department performs implementation of these algorithms onto FPGAs or ASCIs and develops the corresponding equipment hardware. Software co-integration is strongly supported by the development flows used as well as System-on-Chip (SoC) solutions using RISC-V architectures.
Interfacing to RF modules is provided by development capabilities for mixed signal ASICs that allow automated calibration and tuning of RF chains or easy configuration of larger RF module arrays.
Last but not least, the software development department implements the necessary applications running on different platforms SoCs or standalone controllers. Beyond ordinary space applications, applications with complex algorithms, timing critical tasks as well as the capability to be extendable in orbit have been developed.
Digital & ASIC/FPGA Design
ASIC & FPGA development (capable of mixed signal & full custom designs)
Digital signal processing, e.g. channel coding, modulation, synchronization & data management
Consulting in algorithm design, signal processing & digital unit design
IP & soft core integration
Modulators & demodulators
Transceiver & signalprocessing units up to 100 Gbps
TESAT‘s design department acts as a central link between development and operations for all aspects of mechanical, PCB and ceramic hybrid module designs. In close coordination with our customers, design requirements are translated into complete data sets for manufacturing as well as customer documentation. Design and manufacturing guidelines are incorporated and continuously refined to get optimum results for internal or external manufacturing processes.
Our analysis department provides expertise and information to adapt designs to specific space environments, regarding all mechanical, thermal, electrical or radiative aspects. It supports our customers in defining environmental conditions, calculates safety margins, performs complete analyses and associated environmental tests.
PCB & modules design
PCB & module designs with emphasis on RF, high voltage, high power, high speed digital & mixed signal with up to 30 layers
Experienced in various PCB technologies like metal core, rigid / rigid-flex & flex as well as cavity based
Complete layout for PCBs, PWBs & substrates
Preferred input formats for PCB & module designs are: